Santa Clara, CA – September 15, 2014 – eASIC Corporation®, the leading provider of Single Mask Adaptable ASIC™ devices today announced that it has joined the Open NAND Flash Interface (ONFi) working group, an organization of industry-leading companies dedicated to simplifying the integration of NAND flash memory into consumer electronics devices, computing platforms and industrial systems.
“eASIC is dedicated in delivering fast, customizable solutions at 28 nm that can be delivered in as few as seven (7) weeks from final netlist to first prototypes”, said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC. “Working with ONFi, we can assure our devices also deliver the fastest and most efficient NAND flash interfaces that customers need to be competitive.”
“We are pleased to have eASIC join the ONFi working group”, said Amber Huffman, chairperson for the ONFi working group. “eASIC and ONFi share a desire to quickly enable customers building high bandwidth Flash based storage systems to achieve low latency, improved performance, while reducing power consumption.”
The ONFI working group is dedicated to simplifying integration of NAND Flash memory into consumer electronics (CE) applications and computing platforms. Before the advancements made by the working group, use of NAND Flash in these end-use applications was hampered by the lack of sufficient standardization. To support a new NAND Flash component on a platform, host software and hardware changes were often required. Implementing these changes was extremely costly due to the new testing cycle required – which led to slower rates of adoption for new NAND Flash components. ONFi aims to remedy that problem and speed time to market for NAND Flash based applications.
The ONFi working group was formed in May 2006 and currently has more than 100 member companies. ONFi’s founding companies include Intel Corporation, Micron Technology, Inc., Phison Electronics Corporation, SanDisk, SK Hynix, Sony Corporation, and Spansion.
eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance, fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.