Entropic, ViXS Systems Settle All Litigation, Execute Cross-License
Update: Entropic was acquired by MaxLinear for a total consideration of $287 million on February 3, 2015.
SAN DIEGO, CA -- September 15, 2014 -- Entropic (NASDAQ: ENTR), a world leader in semiconductor solutions for the connected home, and ViXS Systems Inc. (TSX: VXS), a pioneer and leader in media processing solutions, today announced they have settled all outstanding litigation between the companies and have agreed to a cross-license to the patents at issue in the litigation.
Entropic, ViXS and certain of their subsidiaries have been engaged in several patent lawsuits in the federal courts as well as proceedings before the International Trade Commission. Under the settlement agreement, all outstanding claims and counterclaims in those actions will be dismissed against all defendants, including DIRECTV, Wistron NeWeb Corporation (WNC) and CyberTAN.
The settlement also includes a cross-license between Entropic and ViXS of the issued patents that were the subject of the litigation. No fees or royalties are payable by either party with respect to its business as currently conducted or planned. Other terms of the settlement were not disclosed.
The companies each expressed satisfaction with the litigation settlement.
"Today's settlement allows both companies to move on as two of the industry's innovation leaders," said Patrick Henry, president and CEO, Entropic. "We have set aside our differences while addressing the needs of our customers, our shareholders and the industry."
"We are pleased to find an amicable and effective solution to the litigation with Entropic," said Sally Daub, President and CEO, ViXS. "We expect to continue the productive collaboration the companies have established over the years."
About Entropic
Entropic™ (NASDAQ: ENTR) is a world leader in semiconductor solutions for the connected home. The Company transforms how traditional HDTV broadcast and IP-based streaming video content is seamlessly, reliably, and securely delivered, processed, and distributed into and throughout the home. Entropic's next-generation Set-top Box (STB) System-on-a-Chip (SoC) and Connectivity solutions enable Pay-TV operators to offer consumers more captivating whole-home entertainment experiences by transforming the way digital entertainment is delivered, connected and consumed -- in the home and on the go. For more information, please visit Entropic at: www.entropic.com.
About ViXS Systems Inc.
ViXS is the pioneer and market leader in designing revolutionary media processing semiconductor solutions for the broadcasting and consumer electronics industries, with over 467 patents issued and pending worldwide, numerous industry awards for innovation, and over 31 million media processor shipments to date. ViXS is driving the transition to Ultra HD 4K across the entire content value chain by providing professional and consumer grade chipsets that support the new High Efficiency Video Coding (HEVC) standard up to Main 10 Profile, reducing bandwidth consumption by 50% while providing the depth of color and image clarity needed to take advantage of higher-resolution content. ViXS' XCodePro 300 family is ideal for Ultra HD 4K infrastructure equipment, and the XCode 6000 family of system-on-chip (SoC) products achieve unprecedented levels of integration that enable manufacturers to create cost-effective consumer entertainment devices.
|
Related News
- Axis Systems and Mentor Graphics Settle Litigation; Agree to Patent Cross-license
- TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
- Western Digital And IBM Announce Patent Acquisition And Cross-License Agreements
- Ericsson and Apple sign global patent license agreement, settle litigation
- Motorola and WiLAN Settle Litigation
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |