Samsung Now Mass Producing Industry's First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
Seoul, Korea -- Sep. 19. 2014 -- Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing its six gigabit (Gb) low-power double data rate 3 (LPDDR3) mobile DRAM, based on advanced 20 nanometer (nm) process technology. The highly-efficient new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.
“Our new 20nm 6Gb LPDDR3 DRAM provides the most advanced mobile memory solution for the rapidly expanding high-performance mobile DRAM market,” said Jeeho Baek, vice president, memory marketing, Samsung Electronics. “We are working closely with our global customers to offer next-generation mobile memory solutions that can be applied to a more extensive range of markets ranging from the premium to standard segments."
Samsung’s new 6Gb LPDDR3 has a per-pin data transfer rate of up to 2,133 megabits per second (Mbps). A 3GB (gigabyte) LPDDR3 package, which consists of four 6Gb LPDDR3 chips, can be easily created for use in a wide range of mobile devices. Also, the package greatly strengthens our product portfolio for premium mobile applications,
The new 3GB package is more than 20 percent smaller and consumes about 10 percent less energy than the currently available 3GB package with 6Gb LPDDR3 chips fabricated using Samsung’s previously lowest process technology. This results in a mobile memory that is ultra-small, incredibly thin, lightning fast and significantly more power-efficient.
Utilizing Samsung’s new 20 nanometer process also brings more than a 30 percent productivity gain, compared to the previous process. Samsung first applied 20 nanometer technology on 4Gb DDR3 for PCs in March, for the first time in the industry, and has now expanded its use to include the company’s mobile DRAM.
In the future, Samsung will continue to introduce more advanced 20nm mobile DRAM products to further strengthen its product line-up and maintain its leadership in the high-density mobile DRAM market, as the market expands with more feature-laden flagship smartphones, high-end tablets and wearable devices.
|
Related News
- Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones
- Samsung Starts Mass Producing Industry's First 10-Nanometer Class DRAM
- Synopsys and Samsung Deliver a Complete Solution for 20-Nanometer Node
- Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design
- Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process
Breaking News
- GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
- Celestial AI Acquires Rockley Photonics Patent Portfolio, Strengthening Photonic Fabric IP
- Silicon IP Provider, Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+
- M31 Once Again Ranked Among Forbes' "Asia 200 Best Under a Billion" List
- DeepComputing and Andes Technology Partner to Develop the World's First RISC-V AI PC with 7nm QiLai SoC, Featuring Ubuntu Desktop
Most Popular
- YorChip announces Low Latency 200G Chiplet for edge AI
- Alphawave Semi Q3 2024 Trading and Business Update
- RISC-V Announces Ratification of the RVA23 Profile Standard
- Arteris and SiFive Deliver Pre-verified Solution for the Datacenter Market
- MosChip Technologies joins Renesas RZ Partner Ecosystem as AI/ML Design Partner
E-mail This Article | Printer-Friendly Page |