Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process
SAN JOSE, Calif. -- 26 Sep 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced a broad portfolio of intellectual property (IP) for TSMC’s 16nm FinFET Plus (16FF+) process. The wide array of IP for the 16FF+ process enables systems and semiconductor companies to take advantage of the 15 percent speed improvement with same total power or 30 percent total power reduction at the same speed compared to the16FF process.
Currently under development for the 16 FF+ process, the Cadence IP portfolio includes multiple high-speed protocols for several key memory, storage and interconnect standards critical in the development of advanced SoC designs. Silicon-tested IP is expected to be available beginning in Q4 2014. For detailed protocol information and availability details, customers should contact their local Cadence salesperson.
Cadence also announced today the qualification of its digital implementation, signoff and custom/analog design tools for the 16nm FinFET Plus process. Click here for more information.
“Our new 16nm FinFET Plus process is an important development for next-generation SoC designs as they balance the task of increasing performance while reducing power and area,” said Suk Lee, senior director of the Design Infrastructure Marketing Division at TSMC. “As a long time trusted TSMC partner, we believe Cadence will play a vital role in the broad adoption of this new process with its certified tools and IP portfolio.”
“Our broad portfolio of IP for 16 FinFET Plus will enable design teams to ramp quickly on next-generation SoC designs and immediately realize the performance and power benefits of this new FinFET process,” stated Martin Lund, senior vice president and general manager of the IP Group at Cadence.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
- Cadence Announces Broad IP Portfolio for TSMC 10nm FinFET Process
- Synopsys Achieves Certification from Multiple Standards Organizations for Portfolio of IP on TSMC 16-nm FinFET Plus Process
- TSMC Certifies Cadence Innovus Implementation System on 16-nanometer FinFET Plus Process
- Cadence USB 3.0 Host Solution on TSMC 16nm FinFET Plus Process Achieves Industry Certification
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |