English
Samsung Shows 14nm Chip
Rick Merritt, EETimes
10/2/2014 07:40 AM EDT
SANTA CLARA, Calif. — Samsung showed a working 14nm FinFET device at the ARM Tech Con here. However the Korean giant would not provide details of the chip, any of its customers for the process, or the status of the process.
At its booth here, Samsung showed a mobile applications processor decoding high-definition video on a handset and a TV screen. It would not say whether the chip was a next-generation version of the company’s Exynos family.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Will 1.4-nm help Samsung catch up with TSMC, IFS?
- SEMIFIVE Achieves Mass Production Milestone of its SoC Platform
- SiFive and Samsung Foundry Extend Partnership to Accelerate AI SoC Development
- Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm
- Cadence DFM Signoff Solutions Achieve Qualification for Samsung 28nm FD-SOI/14nm/10nm Process Technologies
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation