ARM Calls for 'Invisible' Technology
Jessica Lipsky, EETimes
10/2/2014 07:20 PM EDT
SANTA CLARA, Calif. -- Successful technology will be invisible, ARM CEO Simon Segars said in his keynote address at ARM TechCon here. While the physical size of silicon is ever shrinking, connectivity, performance, and efficiency need to be even less visible to consumers.
"We're going to see more and more connected devices with more and more powerful embedded processers within them, with really sophisticated software," he said. "We should take it upon ourselves to make sure that we continue to do a great job of hiding away the complexity, hiding these components and what they do… so we continue to get a great adoption rate."
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Arm Ltd Hot IP
Related News
- ARM's chairman calls for collaboration
- Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform
- Arm's power play will backfire
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program
- Arm's calendar Q2 revenues up 39% y-o-y
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation