Maxim Preps Asynchronous MCU Core
Peter Clarke, Electronics360
06 October 2014
Maxim Integrated Products Inc. (San Jose, Calif.) is working on its own design of 16bit RISC processor core in an asynchronous logic, or clockless, format for the sake of power saving.
The core is intended for use in low power microcontrollers will be a version of Maxim's MaxQ 16bit RISC core. The core will run clockless but will have clocked peripheral circuits and I/O, the company said. The R&D is being done in Dallas, Texas, under Dan Loomis, vice president responsible for medical, energy and embedded security business unit.
Excepting one or two instances asynchronous or clockless logic appears to have fallen out of favor in recent years with R&D efforts on extreme power saving turning instead to clocked logic run at near- or sub-threshold voltages.
However, Maxim has joined such companies as Wave Semiconductor Inc. (Sunnyvale, Calif.) and Tiempo SA (Grenoble, France). The original argument in favour of asynchronous logic was that it could save power compared with equivalent clocked circuits but problems with testing of asynchronous circuits performance variability against temperature seemed to weigh against usage.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Will RISC-V reduce auto MCU's future risk?
- Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation