TSMC Capex to Exceed $10B in FinFET Ramp-Up
Alan Patterson, EETimes
10/16/2014 09:30 AM EDT
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest chip foundry, said Thursday, Oct. 16, that it aims to increase its capital expenditures next year to more than US$10 billion as it accelerates its ramp-up to commercial production of 16 nm FinFET chips.
“Progress is much better than our original plan,” TSMC co-CEO C.C. Wei said at an investor conference to announce the company’s third-quarter 2014 earnings. “Sixteen-nanometer has achieved the best technology and maturity compared to all TSMC’s previous nodes.”
E-mail This Article | Printer-Friendly Page |
|
Related News
Breaking News
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
- TSMC Reports First Quarter EPS of NT$8.70
- Brisbane Silicon publishes DPTx 1.4 IP Core
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance