IEDM reveals diametrically opposed approaches
R. Colin Johnson, EETimes
10/21/2014 06:26 PM EDT
PORTLAND, OR — Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is so far leading the pack by several years. Hot on Intel's heels is IBM, which just signed a deal to turn its fabs over to GlobalFoundries (which has already licensed Samsung's FinFET process that, according to Rick Doherty, research director of The Envisioneering Group, told EE Times stems from early IBM/GlobalFoundaries discussions). TSMC, AMD, Freescale, and others claim to be hot on Intel's and IBM's trail, but have yet to prove it.