IoT Core, ARM SoCs Debut
Rick Merritt, EETimes
10/22/2014 07:45 AM EDT
SANTA CLARA, Calif. — A handful of embedded SoCs, cores, and buses will debut at this week’s Linley Tech Processor Conference where talks will cover the waterfront from carrier networks to the Internet of Things.
The rollout of LTE gave a boost last year to slowly growing embedded markets where Intel’s x86 is the leading architecture, followed by the PowerPC. But multiple vendors are migrating to ARM-based SoCs, chipping away at PowerPC and MIPS-based designs, says Jag Bolaria, a senior analyst at Linley Group.
For example, Freescale will fill out its ARM-based Layerscape family of embedded processors with a new midrange member, the QorIQ LS1043A. The chip, sampling early next year, uses four Cortex-A53 cores running at 1.5 GHz to deliver more than 16,000 CoreMarks at 6 W.
E-mail This Article | Printer-Friendly Page |
Related News
- Arm Accelerates Edge AI with Latest Generation Ethos-U NPU and New IoT Reference Design Platform
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
- proteanTecs Joins Arm Total Design, Brings Lifecycle Health and Performance Monitoring to Arm-based Custom SoCs
- Ceva Joins Arm Total Design to Accelerate Development of End-to-End 5G SoCs for Infrastructure and NTN Satellites
- Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results