UMC Enters Volume Production for Lantiq's Communication ICs
High voltage ICs provide robust performance for land-line applications used in home and office
Hsinchu, Taiwan and Neubiberg/Munich Germany, October 28, 2014 -- United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, and Lantiq, a leading supplier of broadband access and home networking technologies, today announced that UMC has entered volume production for Lantiq’s SPT170 high voltage Power Management ICs (PMIC) used for landline applications. The SPT170 offers the industry’s highest breakdown voltage of all subscriber line interface circuit (SLIC) technologies used in the market, incorporating a custom 2.0um process developed by Infineon Technologies that can handle voltages of up to 170 volts. This high voltage durability provides a robust and reliable interface solution for landlines, which face notoriously harsh environments that include lightning strikes and unintended power contact to the line.
J H Shyu, senior vice president of Production and Operation Integration at UMC said, “Although UMC has been an integral player in the mobile communication revolution, we are also addressing the requirements of landlines, which remain the practical choice for use in homes, offices and institutions. With over 1 billion landlines in operation across the globe, we are happy to address this market with UMC’s volume production of Lantiq’s SPT170 ICs. We look forward to bringing Lantiq’s other products to fruition in the near future.”
Dominik Bilo, COO of Lantiq, “With the delivery of highest quality semiconductor production and excellence in leading-edge processes, UMC is an extremely valuable partner for our manufacturing strategy. We rely on their high-tech expertise and proven processes. With the successful transfer of our SPT170 technology, we ensure consistent production of our mature and field proven voice solutions for many years to come - standing firm behind our product roadmap.”
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s robust foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
About Lantiq
Lantiq enables Carrier Innovations for Next Generation Networks and the Digital Home. Lantiq is a global provider of innovative semiconductor solutions powering broadband, next generation networks and the digital home. With a long history of industry success and leadership, Lantiq’s semiconductor and complementary software solutions are deployed by major carriers and in home networks in every region of the world. Specializing in broadband communications, including analog, digital and mixed-signal ICs, as well as complementary comprehensive software suites, Lantiq enables system manufacturers to design high-speed data and telecommunication systems solutions for broadband access and customer premises equipment.
For more information about Lantiq please visit the Lantiq Website.
|
Related News
- UMC Enters High Volume Touch IC Production using Foundry Industry's First 0.11um eFlash Process
- UMC Enters Volume Production for TSV Process Used to Enable AMD's High-Performance Radeon R9 Fury X GPU
- The worlds leading device for communication in the 2.4 GHz band, Nordic VLSI's nRF2401, enters full volume production
- Kinetic Technologies Adopts Diakopto's ParagonX Platform for High-Performance Power Management and Video/Audio Interface ICs
- Attopsemi's I-fuse OTP IP Embedded into Melexis' Sensor ICs In Mass Production
Breaking News
- Fractile raises $15m seed funding to develop radical new AI chip and unlock exponential performance improvements from frontier AI models
- Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
- Ian Walsh appointed as Sondrel's Regional VP for America
- Systems Designed Today Must Support Post-Quantum Cryptography Tomorrow
Most Popular
- Imagination Technologies announces new capital investment from Fortress Investment Group
- Alphawave Semi: Q2 2024 Trading and Business Update
- Agile Analog delivers customizable IP on GlobalFoundries' FinFet and FDX processes
- Efinix Releases Topaz Line of FPGAs, Delivering High Performance and Low Power to Mass Market Applications
- Comcores supports BAE systems as a key partner with JESD204C IP
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |