MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
TSMC Predicts Next Big Thing
Take CMOS, MEMS, and supply chain and stir.
R. Colin Johnson, EETimes
11/10/2014 11:30 AM EST
PORTLAND, Ore. -- The framework for "the next big thing" is being cast at advanced foundries that offer one-stop shopping for fabless innovators who want to integrate micro-electromechanical system (MEMS) sensors and actuators alongside complementary metal oxide semiconductor (CMOS) circuitry on the same system-on-chip (SoC). Or so envisions Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a vendor positioning itself to be that "one shop."
Besides offering faster turnaround and more reliable sourcing from a single well-oiled supply chain, these advanced foundries will eventually offer dirt-cheap prices at cents per chip, according to George Liu, director of Corporate Development at TSMC at the MEMS Executive Congress 2014 (Nov. 5-7, Scottsdale, Ariz.)
Check out Liu's slides on the following pages.
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