Computer vision, depth mapping, always-on, always-sensing solutions, Bluetooth Smart Ready and Wi-Fi 802.11ac - just some of the technologies CEVA is demonstrating at CES
MOUNTAIN VIEW, Calif., Dec. 9, 2014 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for vision, audio, communications and connectivity, will showcase a range of technologies and solutions set to power the next wave of intelligent connected devices for the Internet-of-Things and beyond, at International CES 2015, January 6-9, 2015. At this show, CEVA will host a meeting suite in the Westgate Las Vegas Hotel (formerly LVH), where invitees can interact with the demonstrations and meet with CEVA engineers, partners and members of the executive team.
Technologies being demonstrated include:
In total, CEVA's suite will feature more than a dozen demonstrations of how CEVA's industry-leading portfolio of DSPs, platforms and connectivity IPs can enable your next-generation SoCs to deliver the functionality you need, while reducing both the power consumption and cost of your overall design. To request a meeting with CEVA at CES, please email events@ceva-dsp.com or contact your local CEVA sales office.
About CEVA, Inc.
CEVA is the world's leading licensor of DSP-based IP platforms for vision, audio, and communications, and connectivity IPs for Wi-Fi® and Bluetooth®. CEVA's portfolio includes comprehensive technologies for computer vision and computational photography, advanced audio and voice processing, 2G/3G/4G/LTE/LTE-A baseband processing, connectivity (including 802.11ac and Bluetooth Low Energy) and serial storage (SATA & SAS). In 2013, CEVA's IP was shipped in more than one billion devices, including 40% of handsets shipped worldwide, powering smartphones from many of the world's leading OEMs such as Coolpad, HTC, Huawei, Lenovo, LG, Nokia, Samsung, TCL, Xiaomi and ZTE. For more information, visit www.ceva-dsp.com.