Kintex UltraScale KU040 FPGAs to provide an estimated one year time to market advantage relative to its competition
SAN JOSE, Calif., Dec. 18, 2014 -- Xilinx, Inc. (NASDAQ: XLNX) today announced that its Kintex® UltraScale™ KU040 FPGAs are now the industry's first 20nm device to move into volume production. Customers can benefit from an estimated one year time to market advantage relative to its competition. Built on the industry's only ASIC-class architecture, the mid-range Kintex UltraScale devices provide optimal price/performance/watt for a broad set of applications that include 100G OTN, packet processing and traffic management, 8X8 Mixed Mode LTE and WCDMA Radio, 8K/4K displays, Intelligence Surveillance and Reconnaissance (ISR), Data Center and more.
"Building on the strength of our innovation, strong engineering execution, and commitment to absolute quality, Xilinx is pleased to move the KU040 into full production," said Wouter Suverkropp, senior product line manager for Kintex FPGAs at Xilinx. "This milestone follows months of design work by our customers, leveraging the performance of the UltraScale architecture."
Customers can place orders for the KU040 FPGAs today by contacting their local Xilinx sales representative. Kintex UltraScale development and evaluation boards are available from Xilinx and its Alliance Members. Xilinx boards include the KCU105 universal development board and the KCU1250 transceiver evaluation board. To buy these boards, visit www.xilinx.com/boards-and-kits.
About Kintex UltraScale FPGAs
Kintex UltraScale FPGAs deliver up to 1.16M logic cells, 5,520 optimized DSP slices, 76 Mbits of block RAM, 16.3Gbps backplane-capable transceivers, PCIe® Gen3 hard blocks, integrated 100Gb/s Ethernet MAC and 150 Gb/s Interlaken IP Cores, and DDR4 memory interfaces operating at 2,400 Mb/s. Kintex devices established the new mid-range with best price/performance at the lowest power in 28 nm, and offer the highest DSP count available at 20 nm.
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.