NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Memory Design Trends in 2014
Gary Hilson
EEtimes (12/19/2014 11:00 AM EST)
TORONTO — If there is one enduring trend for memory design in 2014 that will carry through to next year, it’s the continued demand for higher performance.
“The trend toward high performance is never going away, and research and engineering will always be focused on trying to keep up,” Lou Ternullo, product marketing director of memory and storage IP at Cadence, tells us. At the same time, the goal is to keep costs down, especially when it comes to consumer applications using DDR4 and mobile devices using LPDDR4. “Consumer applications are particularly sensitive to cost,” he says.
Ternullo believes LPDDR4 will gain a strong foothold in 2015, and not just to address mobile computing demands. Other applications that require lower cost, lower power consumption, and higher performance will benefit from LPDDR4, such as HDTVs, cameras, and other display devices -- and designers will need to adapt to the demand.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Memory Suppliers Account For More Than 60% of 300mm Wafer Capacity
- Uniquify to Present High-Performance DDR3 Memory System in Low-Cost Wire Bond Package, Fastest DDR4 Memory IP at CSIA-ICCAD 2014 in Hong Kong
- Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at CSIA-ICCAD 2014 in Hong Kong
- Altera to Demonstrate FPGA Technologies at Flash Memory Summit 2014
- Xilinx Showcases Smarter Solutions for Data Center Flash Storage and Application Acceleration at Flash Memory Summit 2014
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation