Industry's most widely deployed DSP architecture brings advanced audio processing and ultra-low power consumption to InfoTM's next-generation application processors
MOUNTAIN VIEW, Calif., Jan. 5, 2015 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for vision, audio, communications and connectivity, today announced that Shanghai InfoTM Microelectronics has licensed the CEVA-TeakLite-4 DSP to support advanced audio capabilities in its next-generation application processors targeting smartphones, tablets and other mobile devices.
"Following a detailed selection process, the CEVA-TeakLite-4 DSP proved to be the lowest-power choice for high-performance audio processing required for next-generation application processors," said Kurt Zhang, Product Director at Shanghai InfoTM Microelectronics. "The low power capabilities combined with CEVA's comprehensive audio software offerings and excellent technical support provides us with a complete, end-to-end audio solution for our next-generation application processors."
"We are pleased to announce InfoTM as the latest in a long list of licensees of our CEVA-TeakLite-4 DSP," said Eran Briman, vice president of marketing at CEVA. "Support for advanced audio capabilities is mandatory in nearly every mobile computing device today and our latest generation CEVA-TeakLite-4 DSP enables InfoTM to address any audio use case, while consuming less power than alternative architectures."
The CEVA-TeakLite-4 is the fourth generation DSP based on CEVA-TeakLite, the most successful licensable DSP architecture in the history of the semiconductor industry, with more than 3 billion audio/voice chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice software packages available. The CEVA-TeakLite-4 is offered as a scalable and extensible architecture framework, allowing customers to choose the optimal family member core to address their specific audio/voice application needs. By taking advantage of the unified software ecosystem, a set of optimized software libraries and the integrated development environment, customers can easily reduce software development costs significantly while leveraging their software investment in future products. For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor of DSP-based IP platforms for vision, audio, and communications, and connectivity IPs for Wi-Fi® and Bluetooth®. CEVA's portfolio includes comprehensive technologies for computer vision and computational photography, advanced audio and voice processing, 2G/3G/4G/LTE/LTE-A baseband processing, connectivity (including 802.11ac and Bluetooth Low Energy) and serial storage (SATA & SAS). In 2013, CEVA's IP was shipped in more than one billion devices, including 40% of handsets shipped worldwide, powering smartphones from many of the world's leading OEMs such as Coolpad, HTC, Huawei, Lenovo, LG, Nokia, Samsung, TCL, Xiaomi and ZTE. For more information, visit www.ceva-dsp.com.
About Shanghai InfoTM Microelectronics
Shanghai InfoTM Microelectronics Co., Ltd. is a professional IC design company which is dedicated to the research and development of its applications processor chip. InfoTM's chips are mainly applicable to multimedia terminals, intelligent terminal, high definition video, and other high-end consumer electronic products. Meanwhile, InfoTM can provide solutions that offer high integration, high stability, high-performance and low cost for the terminal manufacturers and the other links of the industrial chain.