Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
IoT Feels Unintended Consequences
John Daane, Altera Corp.
EETimes (1/8/2015 10:50 AM EST)
The Internet of Things will require more horsepower in datacenter servers and flexibility at end nodes for security -- issues that play well to FPGAs.
As we look toward 2015, many of the dynamics that have supported the programmable logic industry in recent years remain in place. ASIC and ASSP design-costs spiral, uncertainties about functionality grow, and high-volume opportunities are rare.
New dynamics and the evolving Internet of Things (IoT), however, are creating an uncertain environment with unintended consequences. As the industry struggles to make the IoT work, two trends will emerge that play directly into the strengths of programmable logic, creating great opportunities for FPGAs.
The concept behind the IoT is simple: If a device is controlled by electronics, you can simply connect the controller to the Internet to accept commands with a smartphone or cloud application. The end result is a device composed of sensors and actuators with network interfaces, all connecting across the Internet to control software.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Altera Hot IP
Related News
- Faraday Adds QuickLogic eFPGA to FlashKit‑22RRAM SoC for IoT Edge
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- Axelera AI and Kudelski IoT Partner for Next-Generation Edge Intelligent Ecosystem
- Kudelski IoT and u-blox collaborate to bring advanced security to autonomous driving, drones and agricultural applications
- Qualcomm to Bolster AI and IoT Capabilities with Edge Impulse Acquisition
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation