MagnaChip to Offer Enhanced 0.13 Micron Embedded EEPROM Process Technology
SEOUL, South Korea and CUPERTINO, Calif., Feb. 2, 2015 -- MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today that it now offers a high voltage option for its 0.13 micron embedded EEPROM technology. This enhanced process increases noise immunity by improving the signal-to-noise ratio (SNR), a critical factor in touch sensing IC performance.
0.13 micron embedded EEPROM IP enhances the performance of touch controller ICs and MCUs by decreasing the density of 32Kbyte memory blocks by approximately 50% and by adding a high voltage (HV) option. The newly developed HV option, which features 10V and 20V transistors, requires the least amount of masks to implement and is completely independent of the 0.13 micron EEPROM logic to insure a seamless integration. Overall, this process technology enhances the functionality and performance of IC designs by improving the signal-to-noise performance.
MagnaChip also intends to release a 30V version in 2015, which is suitable for larger screen mobile applications. Along with the 0.18 micron embedded EEPROM, the 0.13 micron embedded EEPROM technology, through its various HV options, completes MagnaChip's embedded EEPROM technology portfolio. This is confirmation that MagnaChip is taking the necessary steps to provide the embedded EEPROM options our customers most need.
Namkyu Park, Executive Vice President of MagnaChip's Semiconductor Manufacturing Services Division stated, "We are very pleased to now offer a high voltage option for our enhanced 0.13 micron embedded EEPROM technology. Our goal is to continue to develop competitive features that meet the increasing application specific needs of foundry customers."
About MagnaChip Semiconductor
Headquartered in South Korea, MagnaChip Semiconductor is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications. MagnaChip Semiconductor believes it has one of the broadest and deepest ranges of analog and mixed-signal semiconductor platforms in the industry, supported by its 30-year operating history, a large portfolio of registered and pending patents, and extensive engineering and manufacturing process expertise. For more information, please visit www.magnachip.com.
|
Related News
- MagnaChip and YMC to Offer Cost Effective 0.13 micron Multiple-Time Programmable (MTP) IP Solutions
- MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology
- Mentor Graphics Introduces its High-Speed USB-Certified PHY for Embedded Host Applications in the SMIC 0.13 micron Process
- Virage Logic offers Hi-Performance, Phase Compliant Embedded Memory Products for UMC's Advanced 0.13 Micron Manufacturing Process
- Virage Logic is first to deliver embedded memory on TSMC 0.13 micron process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |