NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
ARM Pumps Mali in Mobile Graphics
Jon Peddie, President, Jon Peddie Research
EETimes (2/3/2015 08:50 PM EST)
ARM's new Mali-T800 graphics cores give it a shot at its ambitious goal of stealing share from Imagination and Qualcomm in mobile graphics.
With its new Mali-T800 graphics core family, ARM has a new weapon in its ambitious goal of winning designs in more than 600 million SoCs in 2015. There’s no clear way at this point to measure exactly how the new cores stack up against heady competition from Imagination Technologies, Qualcomm and others, but it’s a safe bet ARM will expand its market share in graphics this ear.
The new family includes the Mali-T820, Mali-T830 and Mali-T860 GPUs, expected to start appearing in SoCs in the middle of this year and in handsets by early 2016. The Mali-T820 and Mali-T830 offer up to four shader cores, scaling to 16 shader cores in the Mali-T860 to serve a range of systems from smartphones to ChromeBooks.
The Mali-T820 provides up to 40 percent more performance density compared to the Mali-T622 GPU. The Mali-T830 strikes a balance of performance and efficiency, delivering up to 55 percent more performance than the T622. The T860 is for the most demanding consumers who want a great visual experience on their mobile device, providing high performance and 45 percent more energy-efficiency compared to the T628
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Arm Ltd Hot IP
Related News
- Samsung and ARM Expand Relationship to Drive Graphics Processing for Future Mobile and Consumer Products
- ARM Leads The Mobile Market Into Console-Quality 3D Gaming
- Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors
- Latest ARM Premium Mobile Technology to Drive Immersive Experiences
- ARM Unveils its Highest Performing, Most Power-Efficient 4K-Capable Mobile Display Processor
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation