Showcasing the latest advances in computer vision, computational photography, audio, voice, sensing, cellular communications, Bluetooth & Wi-Fi technologies; Visit CEVA at booth A50, hall 6
MOUNTAIN VIEW, Calif., Feb. 18, 2015 –
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, will showcase its portfolio of leading-edge licensable solutions for intelligent mobile devices at Mobile World Congress 2015. For a preview of what's on show at the Congress, please visit http://events.ceva-dsp.com/mwc15/
Building on its industry leadership in DSP cores and platforms that power 1 in every 3 handsets sold worldwide today, the Company's significantly expanded product offerings are designed to power a new era of intelligent mobile devices that can communicate, sense, recognize and analyze.
These technologies include:
Mobile World Congress 2015 takes place in Barcelona, Spain from March 2nd to 5th. CEVA will be located at stand A50 in Hall 6. To request a meeting with CEVA please email events@ceva-dsp.com or contact your local CEVA sales office.
About CEVA, Inc.
CEVA is the world s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA s IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core.
CEVA is publicly traded in New York (NASDAQ: CEVA) and in London (LSE: CVA).