Santa Clara, CA – March 2, 2015 – eASIC Corporation, a fabless semiconductor company that delivers a custom integrated circuits (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP) today announced the immediate availability of the Common Public Radio Interface (CPRI) v6.1 for eASIC’s Nextreme-3 28nm devices.
With an increased line rate up to 12.165Gbps and improved line coding efficiency, CPRI v6.1 supports an increased RF signal bandwidth of up to 240MHz needed for the proliferation of C-RAN fronthaul networks. When combined with the new ETSI (European Telecommunications Standards Institute) ORI (Open Radio Interface) ISG (Industry Specifications Group) standard for 2:1 LTE lossless compression algorithm, the effective RF signal bandwidth for CPRI v6.1 can be increased to 480MHz bandwidth while meeting 3GPP LTE RF performance and latency requirements.
The new CPRI v6.1 IP with integrated ORI compliant compression engine in an eASIC Nextreme-3 custom IC platform allow developers to implement more efficient digital DAS (Distributed Antenna Systems) and remote radio head solutions in a zero-footprint form factor. As an example a 2×2 low power radio can be deployed using a 240MHz signal bandwidth per antenna either in contiguous or non-contiguous spectrum applications making it ideal for high performance neutral-host multi-operator and multi-band DAS applications. Alternatively, a 4×4 radio head can be implemented using 120MHz bandwidth per antenna.
The combination of eASIC Nextreme-3 custom IC platforms with 12.5Gbps serial transceivers and Comcores highly integrated CPRI v6.1 IP with compression engine compliant to ORI standard provides a compelling solution that consumes a fraction the power of alternatives, enabling zero-footprint radio modules and drastically reducing the amount of optic fiber connectivity.
“Efficiency, in terms of cost, power and time to market, are paramount to enabling LTE-Advanced and 5G wireless communication systems”, said Jasbinder Bhoot, Vice President of Worldwide Marketing at eASIC. “The Comcores CPRI v6.1 IP implemented in an eASIC Nextreme-3 platform not only enables next generation radio, but also open up a wide range of optical and outdoor microwave fronthaul system applications.”
About eASIC Corporation
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom ICs, creating value for our customers’ hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our ASICs, delivered using either our easicopy or standard ASIC methodologies and our proprietary design tools. We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners.
Comcores is a leading provider of silicon agnostic IP-cores for wireless communication with a particular focus on front-hauling and cloud-RAN. State-of-the-art know how and practical experience enabling connectivity in wireless systems are key elements in Comcores’s delivery of unique, high quality, production-proven IP-cores. Comcores solutions not only accelerate development and cut costs; they increase overall design reliability and project predictability.
To learn more about IP-core offerings from Comcores please visit www.comcores.com or contact us at firstname.lastname@example.org.