Freescale-NXP Merger Leaves Fewer Viable Alternatives in Chip Market
Dale Ford, Vice President, Semiconductors & Components, IHS Technology
Electronics360 (March 2, 2015)
The announced merger of Freescale Semiconductor Inc. and NXP Semiconductor for $11.8 billion has important implications from a buyer-side perspective.
When Renesas and NEC merged, many companies were left looking for another second source supplier, and they turned to Freescale and NXP. Now, with the merger of these two companies, there are pluses and minuses. First, the combined company should have greater resources to devote to support the significant pick-up of customers they took from Renesas/NEC when they went looking for another second source. But, second, the industry consolidation just became that much greater meaning as there are fewer viable alternatives of major suppliers for vendors to choose from.
E-mail This Article | Printer-Friendly Page |
Related News
- What Freescale-NXP Merger Can Teach Us
- ASOCS and CMCC team up to deliver mass market high capacity, commercially viable C-RAN solutions
- SOC market opportunities favor fewer players, says research firm
- Innova finalizes its flow and resource management software platform and opens up to the international market
- Renesas to Acquire PCB Design Software Leader Altium to Make Electronics Design Accessible to Broader Market and Accelerate Innovation
Breaking News
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs
- Semiconductor Capacity Is Up, But Mind the Talent Gap
- Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows