NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Microsemi Announces High Performance SmartFusion2 SoC FPGA Dual-axis Motor Control Kit
IP Suite and Reference Design Simplifies Motor Control Designs, and Provides 30,000 RPM Performance
ALISO VIEJO, Calif., March 11, 2015 -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by reliability , low power, performance and security, today announced availability of its SmartFusion2™ SoC FPGA dual-axis motor control kit with a modular motor control IP suite and reference design. The kit, which simplifies motor control designs using a single SoC FPGA, accelerates time to market and is scalable across multiple industries such as industrial, aerospace and defense. Typical applications include factory and process automation, robotics, transportation, avionics and defense motor control platforms. The SoC integration of system functions helps to lower total cost of ownership.
The SmartFusion2 SoC FPGA dual-axis motor control kit comes ready to use out of the box with a compact evaluation board (hardware), access to Microsemi's encrypted motor control IP, and a Libero Gold Edition (software) license to jumpstart motor control designs. The kit uses a modular SmartFusion2 SoC FPGA daughter card that enables customers to easily partition their motor control solutions for hardware only or hardware/software implementation using the modular motor control IP suite and the ARM® Cortex™ M3 MCU in SmartFusion2.
Microsemi's new starter kit is ideal for customers who need scalable multi-axis motor control, and more performance than an MCU/DSP-based kit, with the ability to integrate additional system function on the FPGA to realize lower cost of ownership. The kit provides a flexible design platform for customers to scale motor/motion control solutions across compact, standard and premium AC drives and custom stepper/servo motor applications.
"The modular approach to the SmartFusion2 SoC FPGA dual-axis motor control kit helps to customize the solution for the customer," said Shakeel Peera, senior director of FPGA/SoC marketing for Microsemi. "Scalability also allows for a different combination of motors. With this design kit, customers can spend less time on qualifying new devices and more time on growing their business."
SmartFusion2 with Microsemi's motor control IP enables customers to offload CPU/DSP processing to the FPGA for faster parallel processing. The modular IP suite running on the FPGA is able to drive two BLDC/stepper motor channels with the motor controller kit (while the IP can scale to six-axis) or drive motor performance beyond 30,000 RPM. Furthermore, with the International Energy Agency (IEA) estimating that electric motors represent more than 45 percent of all electrical energy consumption, SmartFusion2 SoC FPGAs can lower total device power consumption by more than 50 percent and lowers static power by 10 times over competing SRAM-based FPGAs. The best-in-class security features available in SmartFusion2 also safeguard connected motors against malevolent hackers and intellectual property theft.
According to a market research report from The Freedonia Group, the U.S. market for electric motors is forecast to expand 5.4 percent per year through 2018 to $16.2 billion, accelerating from the 2008-2013 period. Electric motors are key components in many durable goods, and as a result, suppliers will benefit from solid gains in heating, ventilation, and air conditioning (HVAC) equipment; machinery and motor vehicle output.
Availability
For a limited time, the kit will be priced at a promotional value of $599 and will be available through distribution partners. Order kit part # SF2-MC-STARTER-KIT. To learn more about the new SmartFusion2 SoC FPGA dual-axis motor control kit, visit http://www.microsemi.com/products/fpga-soc/design-resources/system-solutions/motor-control or contact Microsemi's sales team at sales.support@microsemi.com.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and Midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
|
Microsemi Hot IP
Related News
- Microsemi Steps Up Its Cyber Security Leadership in FPGAs: SmartFusion2 SoC FPGAs and IGLOO2 FPGAs Enhanced with Physically Unclonable Function Technology
- Microsemi Announces PCI Express 2.0 SIG Certification for the Industry's Lowest Power SmartFusion2 SoC FPGAs and IGLOO2 FPGAs
- Microsemi Releases Industry-leading EnforcIT Security Monitor; Advanced Security IP for Its SmartFusion2 SoC FPGAs and IGLOO2 FPGAs
- Microsemi Announces System Builder Design Tool for ARM-based SmartFusion2 SoC FPGA Designs
- Microsemi Integrates Inicore Enhanced Reliability CAN IP into SmartFusion2 SoC FPGA
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |