Hitachi Expands SOC Capabilities with inSilicon's Hi-Speed USB 2.0 PHY

Certified mixed-signal technology accelerates next-generation chip performance

San Jose, CA , August 05, 2002 - inSilicon Corporation (Nasdaq: INSN) -- a leading provider of connectivity intellectual property (IP) technology for complex systems-on-chip (SOC) -- today announced that Hitachi, Ltd., located in Japan, has licensed inSilicon's USB 2.0 PHY with USB 2.0 Transceiver Macrocell Interface (UTMI) for Hitachi's SOC development.

Hitachi develops SOC solutions for digital imaging applications such as printers, scanners, and digital cameras. Under the terms of the agreement, Hitachi will integrate inSilicon's certified USB 2 PHY in their embedded H8S and SH processor-based SOC designs to provide cost-effective, high-speed USB solutions for the LSI semiconductor market. Compared to USB 1.1, the new high-speed USB 2.0 standard accelerates performance 40 times faster.

inSilicon's USB 2 PHY is the world's first semiconductor IP to pass Hi-Speed USB 2.0 compliance testing--a key achievement in ensuring functionality and interoperability in next-generation USB 2.0 PC and consumer products. The PHY is a complete mixed-signal semiconductor IP solution designed for single-chip USB 2.0 integration in both device and host applications. The USB 2 PHY integrates high-speed, mixed-signal, custom CMOS circuitry compliant with the industry-standard UTMI specification. USB 2 PHY technology supports the USB 2.0 480 Mbps protocol and data rate, and is backward compatible with the USB 1.1 legacy protocol at 1.5 and 12 Mbps.

"Consumer products with USB 2.0 functionality will increase dramatically in 2003. inSilicon's stellar track record for USB semiconductor IP, combined with their technical expertise and support, ensures successful connectivity for our SOCs," said Hiroyuki Koizumi, manager, IP & CPU core development department, semiconductor & integrated circuits of Hitachi, Ltd. "Licensing this sophisticated technology enables us to focus engineering resources on our core SOC designs and gives us significant time-to-market advantages over our competitors."

"Hitachi offers world-class, application-specific SOC solutions," said Xerxes Wania, vice president of mixed-signal business at inSilicon. "Providing our USB 2.0 digital and mixed-signal technology to Hitachi's customers ensures a solution that has been designed and tested for optimal implementation and reuse. Our product delivers USB 2.0 PHY performance and ensures interoperability for their designs."

About inSilicon
inSilicon Corporation (Nasdaq:INSN) is a leading provider of connectivity semiconductor intellectual property used by semiconductor and systems companies to design systems-on-chip that are critical components of innovative wired and wireless products. inSilicon's technology provides customers faster time-to-market, reduced risk, and lower development cost. The company's broad portfolio of analog and mixed-signal products and enabling connectivity technologies, including USB, PCI, Ethernet, IEEE-1394, JPEG, and Java™ Accelerators are used in a wide variety of markets encompassing communications, consumer, computing, multimedia, and office automation.

About Hitachi
Hitachi, Ltd., headquartered in Tokyo, Japan, is a leading global electronics company, with approximately 320,000 employees worldwide. Fiscal 2001 (ended March 31, 2002) consolidated sales totaled 7,994 billion yen ($60.1 billion). The company offers a wide range of systems, products and services in market sectors, including information systems, electronic devices, power and industrial systems, consumer products, materials and financial services. For more information on Hitachi, please visit the company's Web site at http://global.hitachi.com .

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The statements contained in this press release that are not purely historical are forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. These forward-looking statements are based on management's beliefs as well as on a number of assumptions concerning future events made by and information currently available to management. Readers are cautioned not to put undue reliance on such forward-looking statements, which are not a guarantee of performance and are subject to a number of uncertainties and other factors, many of which are outside inSilicon's control, that could cause actual results to differ materially from such statements. For a more detailed description of the factors that could cause such a difference, please see inSilicon's filings with the Securities and Exchange Commission including its Annual Report on Form 10-K. inSilicon disclaims any intention or obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise. This information is presented solely to provide additional information to further understand the results of inSilicon.

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