MPEG LA Expands HEVC License Coverage
Additional HEVC Standard Profiles Now Included
DENVER, CO, US – March 19, 2015 – MPEG LA, LLC has announced that the coverage of its HEVC Patent Portfolio License has been updated to conform with recent revisions to the HEVC standard as defined in Recommendation ITU-T H.265 v2 (10/2014) (see http://www.mpegla.com/main/programs/HEVC/Pages/AgreementExpress.aspx).
As a result of the update, the profiles covered by the HEVC Patent Portfolio License now include
- Main profile
- Main 10 profile
- Main Still Picture profile
- Multiview profile: Multiview Main
- Scalable profiles: Scalable Main and Scalable Main 10
- Format range extensions profiles: Monochrome, Monochrome 12, Monochrome 16, Main 12, Main 4:2:2 10, Main 4:2:2 12, Main 4:4:4, Main 4:4:4 10, Main 4:4:4 12, Main Intra, Main 10 Intra, Main 12 Intra, Main 4:2:2 10 Intra, Main 4:2:2 12 Intra, Main 4:4:4 Intra, Main 4:4:4 10 Intra, Main 4:4:4 12 Intra, Main 4:4:4 16 Intra, Main 4:4:4 Still Picture and Main 4:4:4 16 Still Picture
- Format range extensions high throughput profile: High Throughput 4:4:4 16 Intra
The current royalty rates that apply to products which use one or more HEVC profiles remain unchanged.
The HEVC Patent Portfolio License, introduced on September 29, 2014 and available at http://www.mpegla.com/main/programs/HEVC/Pages/AgreementExpress.aspx, is offered for the convenience of HEVC users enabling them to obtain coverage under essential patents owned by multiple patent holders in a single license as an alternative to negotiating separate licenses. MPEG LA’s objective is to provide worldwide access to as much HEVC essential intellectual property as possible for the benefit of licensees. Any party that believes it has a patent which is essential to the HEVC standard as defined in Recommendation ITU-T H.265 v2 (10/2014) and would like to participate in the HEVC Patent Portfolio License is welcome to submit its patent(s) for an evaluation of essentiality by MPEG LA’s patent experts and inclusion in the License if determined to be essential. Interested parties may request a copy of the terms and procedures governing patent submissions by going to http://www.mpegla.com/main/programs/HEVC/Pages/Licensors.aspx.
Current patent holders to MPEG LA’s HEVC Patent Portfolio License include Apple Inc.; Electronics and Telecommunications Research Institute; Fujitsu Limited; Hitachi Maxell, Ltd.; HUMAX Holdings Co., Ltd.; IBEX PT Holdings; Industry – Academy Cooperation Foundation of Sejong University; Intellectual Discovery Co., LTD.; JVC KENWOOD Corporation; Korea Advanced Institute of Science and Technology; Korean Broadcasting System; KT Corp.; Kwangwoon University Industry – Academic Collaboration Foundation; M&K Holdings Inc.; NEC Corporation; NEWRACOM, Inc.; Nippon Hoso Kyokai; Nippon Telegraph and Telephone Corporation; NTT DOCOMO, INC.; Orange SA; Samsung Electronics Co., Ltd.; Siemens Corp.; SK Telecom; Tagivan II, LLC; The Trustees of Columbia University in the City of New York; University – Industry Cooperation Group of Kyung Hee University; and Vidyo, Inc.
MPEG LA, LLC
MPEG LA is the world leader in alternative technology licenses. By assisting users with convenient access to patent rights for their technology choices, MPEG LA offers licensing solutions that create opportunities for wide adoption and fuel innovation. MPEG LA’s pioneering MPEG-2 licensing program helped produce the most widely employed standard in consumer electronics history and has become the template for addressing numerous other technologies. Today MPEG LA manages licensing programs consisting of more than 9800 patents in 78 countries with 197 licensors and more than 5900 licensees. For more information, please refer to http://www.mpegla.com
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |