Researchers Claim 44x Power Cuts
New on/off transceivers reduce power 80%
R. Colin Johnson, EETimes
3/30/2015 00:01 AM EDT
PORTLAND, Ore.-- Researchers sponsored by the Semiconductor Research Corp. (SRC, Research Triangle Park, N.C.) claim they have extended Moore's Law by finding a way to cut serial link power by as much as 80 percent. The innovation at the University of Illinois (Urbana) is a new on/off transceiver to be used on chips, between chips, between boards and between servers at data centers.
The team estimates the technique can reduce power up to whopping 44 times for communications, extending Moore's Law by increasing computational capacity without increasing power. "While this technique isn’t designed to push processors to go faster, it does, in the context of a datacenter, allow for power saved in the link budget to be used elsewhere," David Yeh, SRC director of Integrated Circuits and Systems Sciences told EETimes.
E-mail This Article | Printer-Friendly Page |
Related News
- Lattice sensAI 3.0 Solutions Stack Doubles Performance, Cuts Power Consumption in Half for Edge AI Applications
- Synopsys' New USB 2.0 Type-C IP Cuts Power and Area for IoT Edge Applications
- Synopsys' New DesignWare MIPI D-PHY Cuts Area and Power by 50 Percent
- Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X
- Synopsys New Ultra Low-Power Non-Volatile Memory IP Cuts Power by 90 Percent and Size in Half
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024