Samsung Breaks Ground on $14 Billion Fab
World's most expensive semi fab
R. Colin Johnson
5/8/2015 03:18 PM EDT
PORTLAND, Ore. — The world's most expensive semiconductor fabrication plant--at over $14 billion--was announced at the ground breaking ceremony Thursday (May 7) by Samsung. Located in the Godeok Industrial Complex at Pyeongtaek City Gyeonggi-do Province--called "Samsung Semiconductor Valley"--in South Korea, Samsung will be building 10-nanometer FinFET semiconductors there.
"The new fabrication plant in Pyeongtaek constitutes an important part of our vision to establish a globally balanced semiconductor fabrication network that further solidifies our strong global presence," Jim Elliott, corporate vice president, Samsung Semiconductor told EE Times. "The plant will play a key role in our future business initiatives, as we continue to invest in areas that contribute much towards our industry leadership."
E-mail This Article | Printer-Friendly Page |
|
Related News
- Samsung to Invest $7 Billion in China Fab
- Samsung to spend $1.9 billion on logic fab, says report
- Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports
Breaking News
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- RIKEN adopts Siemens' emulation and High-Level Synthesis platforms for next-generation AI device research
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
Most Popular
- Eighteen New Semiconductor Fabs to Start Construction in 2025, SEMI Reports
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Imagination pulls out of RISC-V CPUs
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- RISC-V in AI and HPC Part 2: Per Aspera Ad Astra?