Intel/Qualcomm: The Last Big Move
Rick Merritt, SiliconValley Bureau Chief
5/29/2015 12:12 PM EDT
In the chip game, two big dominoes are waiting to fall.
The glorious, storied semiconductor industry has many more moves to play. But for the foreseeable future yesterday’s news about the new Broadcom reminds us that everyone is playing one big game of consolidation.
In that game there is one last really big move. A combination of Intel and Qualcomm could be the last of the big time mergers in semiconductors. There will no doubt be lots more combinations, but none as large or significant.
The Intel/Qualcomm merger makes sense for a number of reasons. Intel owns computing from the data center down to the notebook but has been unable to establish a position in smartphones. Qualcomm owns the smartphone space but has no real prospects in today’s other huge growth market, cloud computing.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Arm Collaborates with Industry Leaders to Build AI Foundations of the Future
- BSC executes, for the first time, big encrypted neural networks using Intel Optane Persistent Memory and Intel Xeon Scalable Processors
- Intel hints that Microsoft, Qualcomm's Windows 10/ARM x86 emulation could infringe on its IP
- Qualcomm Takes on the World, in Court
- Overall GPU shipments dropped 11% from last quarter, AMD slipped 26%, Nvidia fell 16%, and Intel saw a 7.4% slip
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation