eASIC Licenses Mobiveil's Universal Multiport Memory Controller IP
Availability of Silicon-Proven, Standards-Compliant IP on eASIC Platform Reduces Time-to-Market for Chip Designers.
Milpitas CA – June 9, 2015 – Mobiveil, Inc., a fast growing supplier of silicon intellectual property, today announced that eASIC has licensed Mobiveil’s Universal Multiport Memory Controller (UMMC) IP. Designers using the custom IC (integrated circuit) eASIC Platform now have access to DDR4 and DDR3 memory controllers that are fully compliant with AXI V1.0, DFI 3.1 and JEDEC DDR4 and DDR3 standards, and that support different memory interface data widths, chip select interleaving, and single and multi-port host buses.
“eASIC is pleased to offer Mobiveil’s UMMC IP through the eZ-IP™ Alliance Program,” said Jasbinder Bhoot, Vice President of Marketing at eASIC. “The eZ-IP program brings a wealth of fully verified eASIC ready IP cores to help designers get to market fast. Our eZ-IP partners provide the highest quality IP cores from design to verification and technical support. All eZ-IP Alliance cores are off-the-shelf, pre-qualified and optimized to provide a high performance, low cost implementation for all of the eASIC Platforms, including our latest generation 28nm eASIC Nextreme-3.”
The eASIC Platform provides IC designers with a combination of fast time-to-market, high performance and low power consumption, in a cost effective and customizable silicon solution for hardware and software system design.
“Mobiveil’s UMMC Controller is a highly flexible and configurable design,” said Mobiveil CEO Ravi Thummarukudy. “The controller architecture is tailored to achieve reliable high-frequency operation, dynamic power management and rapid system debug. The controller’s configurable and layered architecture is independent of application logic, PHY designs, implementation tools and target technology. Thus, it supports DDR4, DDR3 standards. And, its flexible AXI System interface makes it easy to be integrated into wide range of applications.”
About Mobiveil
Mobiveil is a fast‐growing technology company that specializes in development of Silicon Intellectual Properties, platforms and solutions for the networking, storage and enterprise markets. Mobiveil team leverages decades of experience in delivering high‐quality, production‐proven, high-speed serial interconnect Silicon IP cores, and custom and standard form factor hardware boards to leading customers worldwide. Mobiveil is headquartered in the Silicon Valley with engineering development centers located in Milpitas, CA, Chennai and Bangalore, India, and sales offices and representatives located in the US, Europe, Israel, Japan, Taiwan and People’s Republic of China. For more information, please visit www.mobiveil.com.
|
Mobiveil Hot IP
Related News
- CloudWave Licenses Mobiveil's Universal NVM Express Controller IP to Accelerate Design for Database Management System Acceleration
- Rambus and Mobiveil Partner to Bring Pre-Validated Solution to Chip Makers, Delivering Memory Flexibility and Accelerated Time-to-Market
- Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory
- Mobiveil to Target Its Universal NOR Flash Controller (U-NFC) to Support Adesto Technologies New eXecute-in-Place Non-volatile Memory (NVM) EcoXiP Chip
- Silicon Motion Licenses Mobiveil's UNEX NVM Express Controller to Accelerate SoC Design
Breaking News
- Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
- Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings
- Rambus MACsec-IP-361 is Certified ASIL-B Ready
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
- U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
Most Popular
- Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks
- Cadence to Acquire Intrinsix Corporation from CEVA
- Intel launches compact RISC-V Nios processor core
- ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors
- SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |