IBM and Candence team to accelerate use of advanced technologies in chip designs
EAST FISHKILL, NY, August 21, 2002 - IBM and Cadence Design Systems, Inc. today announced they are working together to closely integrate Cadence's Design Foundry capabilities with IBM's advanced manufacturing technologies.
The two companies intend to help customers enhance new chip designs by providing a complimentary set of intellectual property (IP), design skills and advanced manufacturing services. IBM's relationship with Cadence is part of a strategy to make IBM's most advanced chip-making technology available through high-volume chip manufacturing services.
"Chip designers are looking to advanced technologies to provide their products with a competitive advantage," said Mike Concannon, vice president of contract manufacturing services for the IBM Microelectronics Division. "Customers are recognizing that our technology can do much more for their products than what traditional foundries are able to provide. Working with major design services providers like Cadence can help customers more easily tap into that technology for their chip designs."
Cadence Design Foundry will design chips utilizing its own cores, IBM's cores, various third party libraries and industry standard design tools, with the final design optimized for manufacture using IBM's leading chip-making processes.
"We are very pleased to be working with IBM to optimize our design attributes with IBM's latest technologies," said Jim Douglas, vice president of sales and marketing, Cadence. "We believe IBM's leading process and high-volume manufacturing capabilities, combined with the expertise of Cadence's Design Foundry, position both companies for continued success in the advanced semiconductor marketplace."
More information about Cadence can be found at: http://www.cadence.com
More information about IBM Microelectronics can be found at: http://www.ibm.com/chips
|
Related News
- VeriSilicon Launches New Families of Advanced Audio / Video Application Platforms to Accelerate Portable Multimedia Designs
- Xilinx Announces Advanced Reference Designs To Accelerate Design Of Flat-Panel Displays
- MIPS Partners With Mobileye to Accelerate Next Generation Autonomous Driving Technologies and Advanced Driver Assistance Systems
- Codasip launches Codasip Labs to accelerate advanced technologies
- Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology
Breaking News
- Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance
- GreenWaves Technologies announces a €20M financing
- Xfuse, LLC Phoenix ISP Now Available as a Download for AMD Kria KV260 Vision AI Starter Kit
- UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
- Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
Most Popular
- Intel kills its RISC-V Pathfinder development kit programme
- Faraday Announces Multi-site Manufacturing Support in ASIC
- Weebit Nano nears productisation, negotiating initial customer agreements
- EU Parliament Adopts Position on Chips Act
- Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |