Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
IBM and Candence team to accelerate use of advanced technologies in chip designs
EAST FISHKILL, NY, August 21, 2002 - IBM and Cadence Design Systems, Inc. today announced they are working together to closely integrate Cadence's Design Foundry capabilities with IBM's advanced manufacturing technologies.
The two companies intend to help customers enhance new chip designs by providing a complimentary set of intellectual property (IP), design skills and advanced manufacturing services. IBM's relationship with Cadence is part of a strategy to make IBM's most advanced chip-making technology available through high-volume chip manufacturing services.
"Chip designers are looking to advanced technologies to provide their products with a competitive advantage," said Mike Concannon, vice president of contract manufacturing services for the IBM Microelectronics Division. "Customers are recognizing that our technology can do much more for their products than what traditional foundries are able to provide. Working with major design services providers like Cadence can help customers more easily tap into that technology for their chip designs."
Cadence Design Foundry will design chips utilizing its own cores, IBM's cores, various third party libraries and industry standard design tools, with the final design optimized for manufacture using IBM's leading chip-making processes.
"We are very pleased to be working with IBM to optimize our design attributes with IBM's latest technologies," said Jim Douglas, vice president of sales and marketing, Cadence. "We believe IBM's leading process and high-volume manufacturing capabilities, combined with the expertise of Cadence's Design Foundry, position both companies for continued success in the advanced semiconductor marketplace."
More information about Cadence can be found at: http://www.cadence.com
More information about IBM Microelectronics can be found at: http://www.ibm.com/chips
|
Related News
- Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
- VeriSilicon Launches New Families of Advanced Audio / Video Application Platforms to Accelerate Portable Multimedia Designs
- Xilinx Announces Advanced Reference Designs To Accelerate Design Of Flat-Panel Displays
- S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development
- Synopsys and TSMC Usher In Angstrom-Scale Designs with Certified EDA Flows on Advanced TSMC A16 and N2P Processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |