8 FD-SOI Questions You're Afraid to Ask
Junko Yoshida, Chief International Correspondent
EETimes (6/30/2015 07:22 AM EDT)
Paul Boudre, CEO of Soitec, told us last week in Grenoble, "Evidence [for FD-SOI's advantages] is there. But some choose not to see it."
PARIS — As a reporter, I’ve never covered a technology that generates more geographically-divided perceptions, innuendo and controversy among semiconductor engineers than FD-SOI.
You’d think that if the choice is a matter of science, engineers would simply pick the one that works better.
However, as with anything in engineering life, choice always involves trade-offs among power, performance, cost, technology readiness, and market-timing.
Perhaps more important, if you’re opting for a less-traveled road (not following your competitors), your decision will involve greater risks. It will impact your company’s future and your own career.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Attopsemi's I-fuse OTP IP Qualified and Available on GLOBALFOUNDRIES 22FDX FD-SOI Platform
- Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
- Attopsemi's I-fuse OTP worked at 0.4V and 1uW read on GLOBALFOUNDRIES 22nm FD-SOI for Fraunhofer Institute for Photonic Microsystems' (IPMS) battery-less 61GHz RFID tags
- Attopsemi's I-fuse OTP Passed 250 degrees Celsius for 1,000hrs Wafer-level Burn-in Studies on GLOBALFOUNDRIES 22FDX FD-SOI Technology
- eMemory's OTP IP Qualified on 22nm FD-SOI process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation