Sonics and AlphaChips Collaborate to Develop Advanced SoC Design Platforms
Korean Design Service Company to Use SonicsGN NoC for IP Integration and the ICE-Grain™ Power Architecture for SoC Power Management
Milpitas, Calif. – July 7, 2015 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) technologies and services, today announced that it is collaborating with AlphaChips, a Korean semiconductor design services company, on the development of advanced SoC design platforms. Sonics will provide the SonicsGN® NoC for integration of semiconductor IP and consult with AlphaChips on the front-end RTL design flow for the SoC platforms. In addition, Sonics will work closely with AlphaChips on power management specification and implementation for the SoC platforms based on its recently introduced ICE-Grain™ Power Architecture.
“We are excited to be working with AlphaChips, one of the leading semiconductor design services firms in Korea,” said Grant Pierce, CEO of Sonics. “AlphaChips has strong business and technical relationships with key system and semiconductor customers. Our collaboration on these new SoC design platforms will give Sonics’ NoC and power management technologies greater exposure in the region.”
“As semiconductor process technology advances rapidly, we are integrating various applications into a single system semiconductor,” said Kyoung Ro Yun, Vice President of SoC Solution at AlphaChips. “The two most important considerations in SoC development are time-to-market and optimizing competitiveness. AlphaChips builds SoC platforms with on-chip network architecture and power management technologies from Sonics because this IP accelerates the SoC development process. Customers using AlphaChips’ platforms can expect to enter the market as soon as possible and ensure a competitive edge. Leveraging Sonics’ IP in our SoC platform implementation enables AlphaChips to focus on providing a complete and a total solution to our customers.”
About AlphaChips
AlphaChips is a Korean provider of semiconductor solutions that owns multiple IPs and products, such as MHL and HDMI, that have been created based on knowledge of high speed data transmission. High speed data transmission between devices is becoming ever more important as high quality audio and high definition video content becomes readily available. AlphaChips delivers to customers the most optimized solutions based on maintaining cutting-edge SoC design technologies. For more information, visit http://www.alphachips.com/eng/index.html.
About Sonics, Inc.
Sonics, Inc. (Milpitas, Calif.) is the trusted leader in on-chip network (NoC) and power-management technologies used by the world’s top semiconductor and electronics product companies, including Broadcom®, Intel®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Sonics’ ICE-Grain™ Power Architecture is the IP industry’s first complete power management solution, which enables SoC designers to exploit “dark silicon” states to save more energy than conventional software-based approaches. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com and LinkedIn.
|
Related News
- LSI Logic to Collaborate With Avnet and Harris Corporation to Develop Advanced SOC Communications for Homeland Security
- NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications
- Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
- Nurlink and Vidatronic Collaborate to Develop SoC for Internet of Things (IoT) Applications
- NetSpeed and Synopsys Collaborate to Enable Early Architectural Exploration of Advanced ADAS and Datacenter SoCs
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |