Agreement Exemplifies eASIC’s Commitment to Deliver Custom Silicon for Improved Performance-Per-Watt Acceleration
SANTA CLARA, Calif.-- August 24, 2015 --eASIC Corp, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and ASOCS, Ltd., a pioneer in virtual radio access networks (vRAN) and provider of fully virtualized network function virtualization (NFV)-compatible virtual base station (vBS) solutions, today announced that they have signed a definitive agreement to develop a custom silicon device for the acceleration of next-generation network virtualization applications utilizing the eASIC Nextreme-3 platform.
“eASIC is the perfect hardware acceleration partner,” said Gilad Garon, CEO of ASOCS, Ltd. “The unique single mask eASIC Platform provides us with the necessary performance-per-watt for acceleration needed to implement a virtual base station while meeting our stringent cost and time to market requirements. We are excited to partner with eASIC and enable a new class of virtual base stations.”
ASOCS has developed a breakthrough architecture that enables the functions of a base station to run on virtual machines that leverage commercial-off-the-shelf servers with a hardware accelerator implemented on the eASIC Nextreme-3 platform.
“We’re delighted to collaborate with ASOCS in its quest to revolutionize the telecom network architecture and the wireless landscape by enabling both centralization and virtualization of the mobile base station,” said Ronnie Vasishta, president and CEO of eASIC. “At eASIC, we’re ushering in a new era of hardware acceleration that’s enabling companies to rapidly bring to market innovative, differentiated products that are finely tuned to the stringent performance, power and cost requirements of leading-edge systems for network function virtualization.”
The tremendous growth of cloud computing has spurred demand for customized chips that make a particular application or workload run faster for data centers, security, big data analytics and other applications. In May 2015, Intel and eASIC announced a joint collaboration to develop products that combine the eASIC Platform with future Intel® Xeon® processors.
eASIC is a semiconductor company offering a differentiated solution that enables us to rapidly and cost-effectively deliver custom ICs, creating value for our customers’ hardware and software systems. Our eASIC solution consists of our eASIC platform which incorporates a versatile, pre-defined and reusable base array and customizable single-mask layer, our ASICs, delivered using either our easicopy or standard ASIC methodologies, and our proprietary design tools.
We believe this innovative technology allows eASIC to offer the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost for our customers. eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Crescendo Ventures, Seagate Technology, Kleiner Perkins Caufield and Byers (KPCB) and Evergreen Partners.
ASOCS is a pioneer in the development of virtual Base Station (vBS) solutions. Enabled by its Modem Processing Unit (MPU), designed to meet current and future Multi - Radio Access Technologies (Multi-RAT) requirements, ASOCS enables the highest possible capacity baseband solutions for next-generation network topologies such as Cloud - Radio Access Networks (Cloud-RAN) and other wireless infrastructure cells from small to macro and beyond. For more information, visit www.asocsnetworks.com.