NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 10-nm FinFET Process
DesignWare IP Portfolio for TSMC 10-nm Process Includes USB, HSIC, PCI Express, DDR, MIPI and Embedded Memories
MOUNTAIN VIEW, Calif., Sept. 17, 2015 -- Synopsys, Inc. (Nasdaq: SNPS) today announced the successful tape-out of a broad portfolio of DesignWare® Interface and Foundation IP on TSMC's 10-nanometer (nm) FinFET process, reducing risk for designers who want to take advantage of the power, area and performance improvements offered by the process. Achieving this tape-out milestone enables designers to accelerate the development of SoCs that incorporate USB 3.1, USB 3.0, USB 2.0, HSIC, PCI Express 3.0, PCI Express 2.0 and MIPI D-PHY interface IP. In addition, Synopsys is developing embedded memories, DDR4, LPDDR4 and MIPI M-PHY IP, which will further extend its 10-nm IP portfolio. TSMC's 10-nm process provides 2.2 times the logic density, a 15 percent performance improvement, and 35 percent power reduction compared to their 16-nm FinFET Plus process node. Taking advantage of the process, Synopsys has re-architected its IP at 10 nm for lower power, higher performance and smaller area compared to the previous generation. As an example, the high-speed SerDes-based PHYs consume less than 5mW/Gb/lane.
"As the leading provider of physical IP, Synopsys has collaborated with TSMC on the development of IP for the 10-nanometer process, enabling designers to achieve the design goals of their next-generation SoCs," said John Koeter, vice president of marketing for IP and prototyping at Synopsys. "By offering a broad portfolio of IP at the TSMC 10-nanometer node, Synopsys is reducing the risks associated with moving to this new process technology."
"Synopsys' track record of providing high-quality IP through many generations of TSMC processes, including 10 nanometers, offers designers a low-risk path to integrating high-performance IP into their SoCs," said Suk Lee, TSMC senior director, design infrastructure marketing division. "Our close collaboration with Synopsys on the development of IP for the TSMC 10-nanometer process enables our mutual customers to reduce their power and area, increase performance and accelerate their time to volume production."
Availability
Front-end kits for DesignWare IP on the TSMC 10 nm process are available now.
About DesignWare IP
Synopsys is a leading provider of high-quality, silicon-proven IP solutions for SoC designs. The broad DesignWare IP portfolio includes logic libraries, embedded memories, embedded test, analog IP, wired and wireless interface IP, security IP, embedded processors and subsystems. To accelerate prototyping, software development and integration of IP into SoCs, Synopsys' IP Accelerated initiative offers IP prototyping kits, IP software development kits and IP subsystems. Synopsys' extensive investment in IP quality, comprehensive technical support and robust IP development methodology enables designers to reduce integration risk and accelerate time-to-market. For more information on DesignWare IP, visit http://www.synopsys.com/designware.
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world's 16th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP, and is also growing its leadership in software quality and security solutions. Whether you're a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest quality and security, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com.
|
Synopsys, Inc. Hot IP
Synopsys, Inc. Hot Verification IP
Related News
- Synopsys Successfully Tapes Out Broad IP Portfolio for TSMC 7-nm FinFET Process
- Synopsys' Custom Compiler Certified for TSMC 10-nm and 7-nm FinFET Process Nodes
- Cadence Announces Broad IP Portfolio for TSMC 10nm FinFET Process
- Synopsys Tools Achieve TSMC Certification for 16-nm FinFET+ Process and Entered 10-nm FinFET Collaboration
- Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |