M31 Technology Displays the "Roaming in the Cloud" IPs
Santa Clara City, California -- September 17, 2015 - At the Open Innovation Platform (OIP) hosted by Taiwan Semiconductor Manufacturing Company on September 17th, M31 Technology Corporation, a developer of Silicon Intellectual Property (IP), highlighted its exhibition space with a creative art work demonstrating the "M31, Roaming in the Cloud" concept as a representation of M31's intellectual property solutions. The creative art was the work of Taiwanese artist Wen-Fu Yu.
H.P. Lin, chairman and CEO of M31 Technology said, "The momentum generated through the integration of art and science is limitless. Both art and science are driven by the pursuit of truth, goodness and beauty -- which serve as the driving force of M31's pursuit of Silicon Intellectual Property. Since its inception in 2011, M31 has been working with the spirit of ultimate craftsmanship in the implementation of its office environment, corporate thinking, and product development processes in order to provide its customers with high quality and innovative IPs. At the September 17th OIP Forum of TSMC, M31 introduced IPs for Internet of Things (IoT) and cloud applications, including a great variety of IPs for ultra-low power intellectual property, the latest USB Type C/USB 3.1, PCIe 3.0, MIPI MPHY v3.0, and Metris which can optimize CPU performance.
Since the 2014 overseas semiconductor exhibition, this is once again the cooperation project between artist Wen-Fu Yu and M31. At this year's exhibition, Yu used cotton and bamboo branches to build a cotton cloud. This artwork was also integrated with 5,000 bamboo sticks to demonstrate the wearable application and "M31, Roaming in the Cloud" concept.
Yu specializes in the use of feathers and bamboo to make large-scale public artworks. Over the past 15 years, Yu has held solo and group exhibitions in Taiwan and abroad. Yu and other Taiwanese artists are invited to exhibit their works at Flushing Meadows Corona Park, Queens, New York City on September 27 to November 23 in 2015 by "The Moment -- Taiwan Art Project". During the New York exhibition, the outdoor artwork "Taiwan's landscape style" will be displayed.
|
M31 Technology Corp. Hot IP
- USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm,6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm)
- PCIe 4.0 PHY in TSMC(6nm,7nm, 12nm,16nm)
- MIPI M-PHY v3.1 IP in TSMC(12/16nm, 28nm, 40nm, and 55nm)
- MIPI D-PHY RX/TX v1.1 / v1.2 IP in TSMC (12/16nm, 28nm, 40nm, and 55nm process)
- SerDes PHY IP in TSMC (7nm, 12/16nm, 22nm, 28nm)
Related News
- M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud
- 28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing
- Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform"
- Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from "Edge to Cloud"
- Arm and AWS: Working together to "Re:Invent" the cloud
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |