Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Design Options for Next Billion IoT Devices
Junko Yoshida, EETimes
9/21/2015 10:22 AM EDT
TOKYO – We’ve all heard enough about the 20 to 50 billion connected devices that are supposed to flood the market by 2020. On one hand, the big numbers expected for the emerging Internet of Things (IoT) market have stirred hope in the semiconductor industry. On the other, many chipmakers are feeling IoT fatigue before the promised market is born.
Sanjay Jha, CEO of Globalfoundries came to the Shanghai FD-SOI Forum last week, and told the audience that it’s time for the industry to define IoT. More important, he said that the industry must develop realistic strategies to meet the technical requisites of IoT devices.
Among a surfeit of theories, predictions and technology horse-race stories on IoT, it’s time to hear from someone who has actually done the due diligence, made design choices and developed his own new IoT chipset.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- ARM Acquires Sensinode Oy to Accelerate the Internet of Things and Support 30 Billion Connected Devices by 2020
- Crypto Quantique announces QRoot Lite - a lightweight and configurable root-of-trust IP for resource-constrained IoT devices
- CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- Arm Brings Transformers to IoT Devices
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation