TSMC Discusses Next MEMS, Monolithic Mics
Peter Clarke, EETimes
9/22/2015 05:58 AM EDT
LONDON — To expand its role as a supplier to fabless MEMS vendors foundry TSMC plans to use its advantages in being able to combine CMOS logic and MEMS sensors together to come up with innovative sensors and use cases.
It plans to do this both through its capabilities in stacking and packaging multiple die and through monolithic integration, according to Kees Joosse, director of business development at TSMC Europe.
Joosse was speaking at the European MEMS Summit, organized by the SEMI trade association in Milan, September 17 and 18, and laid out the strengths in MEMS that TSMC wants to play to and the next platforms that TSMC will offer, MEMS microphones and gas sensors.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Top MEMS Foundries: TSMC passes specialty MEMS players in Yole's annual ranking
- TSMC promises MEMS platform in '06
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- M31 Collaborates with TSMC to Advance 2nm eUSB2 IP Innovation
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC's A16 and N2P Process Technologies
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation