Sony Semiconductor Solutions Corporation to be Established
Reinforcing Devices Segment
October 6, 2015 -- Sony Corporation has been implementing a series of measures to reinforce its Devices segment, a key growth driver for the Sony Group. As part of these measures, Sony will adopt a new operational structure for its Devices segment. The aim of this new structure is to enable each of the three main businesses within this segment, namely the semiconductor, battery and storage media businesses, to more rapidly adapt to their respective changing market environments and generate sustained growth. The Devices segment will continue to be overseen by Tomoyuki Suzuki, Executive Deputy President and Corporate Executive Officer, Sony Corporation.
In the semiconductor business, where image sensors are a primary area of focus, Sony will establish Sony Semiconductor Solutions Corporation ("Sony Semiconductor Solutions") to further reinforce this business, and concentrate on sustained growth. R&D, business control, sales and other operations related to the semiconductor business, which are currently overseen by business groups and R&D units within Sony Corporation, will be transferred to Sony Semiconductor Solutions. The new company will aim to commence operations on April 1, 2016. As part of its mid-term corporate strategy announced in February 2015, Sony outlined its intention to sequentially split out the business units currently within Sony Corporation and operate them alongside existing Sony Group companies. The aim of these measures is to ensure clearly attributable accountability and responsibility from the perspective of shareholders, management policies with an emphasis on sustainable profit generation, and the acceleration of decision-making processes and reinforcement of business competitiveness. The decision to establish Sony Semiconductor Solutions forms part of this strategy.
Terushi Shimizu, currently Deputy President, Device Solutions Business Group, Sony Corporation, is expected to be appointed President, Sony Semiconductor Solutions. Sony Semiconductor Corporation (President: Yasuhiro Ueda) and Sony LSI Design Inc. (President: Makoto Ishii), which cover Sony's semiconductor manufacturing and design operations respectively, will become subsidiaries of Sony Semiconductor Solutions.
In the battery business, Sony Energy Devices Corporation (President: Yoshito Ezure) will continue to engage in integrated business and manufacturing operations. It will remain focused on reinforcing business operations and enhancing product competitiveness, in order to maximize opportunities for expansion in the growing battery market, and enhance its ability to generate profit.
In the storage media business, business functions currently located within Sony Corporation will be transferred to Sony Storage Media and Devices Corporation (President: Mitsunobu Saito), which currently engages in manufacturing. By integrating these business functions and manufacturing operations, the Company aims to ensure continued, stable profit generation. Sony also targets April 2016 for the completion of this transfer.
Related News
- Silicon Catalyst Partners with Sony Semiconductor Solutions to Accelerate Semiconductor Startups
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- Sony Acquires Altair Semiconductor, Israeli Innovator of LTE Modem Chip Technology
- Lattice Semiconductor Announces Serial Image Sensor Bridge Support For Sony IMX136/104
- Lattice Semiconductor Announces Innovative Bridge Design for Sony IMX136 Image Sensor
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |