Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
SMIC to Report Tunnel-FET Extension to CMOS
Peter Clarke, EETimes
10/9/2015 09:14 AM EDT
LONDON—Chinese foundry Semiconductor Manufacturing International Corp. has manufactured complementary Tunnel FETs (C-TFETs) that operate at 0.4V using a CMOS baseline technology.
Because of the low voltage operation, SMIC (Shanghai, China) is declaring that the platform has potential for ultra low-power applications such as the Internet of Things (IoT).
The details are due to be revealed at the upcoming International Electron Devices Meeting (IEDM) scheduled to take place at the Washington D.C. Hilton Hotel from December 7 to 9, 2015.
Although the minimum geometry of the process is not revealed in the abstract of the paper, it is one of the more interesting IEDM papers because of suggestions that a TFET process could be relatively near to deployment. The paper was written by researchers from Peking University and SMIC.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
SMIC Hot IP
Related News
- SMIC Reports 2018 Fourth Quarter Results
- Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
- SMIC Reports 2016 Second Quarter Results
- SMIC Reports 2015 Fourth Quarter Results
- Report: India, China show interest in Korean analog foundry
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation