AM3D to demonstrate ZIRENE® SOUND audio enhancement solution at CEVA Technology Symposium Asia
MOUNTAIN VIEW, Calif., Oct. 27, 2015 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, and AM3D, a leading provider of software solutions for audio enhancement and 3D audio for portable devices, announced today that the companies have partnered to offer AM3D's ZIRENE® SOUND audio enhancement technology for the CEVA-TeakLite-4 audio/voice family of DSPs.
AM3D will demonstrate ZIRENE® SOUND running on a CEVA-TeakLite-4 silicon at the CEVA Technology Symposium Asia this week. More information is available at http://events.ceva-dsp.com/symposium-2015/.
ZIRENE® SOUND enhances audio in HD quality on smartphones, tablets, TVs, portable media players, headphones and other devices in which audio is an essential part of the user experience. The physical specification of such devices means that the size, configuration and power of speakers is far from the optimal combination envisaged by the creators of media content. ZIRENE® SOUND compensates for these inherent limitations by delivering speaker playback optimization and spatial audio effects. It ensures high sound quality with 32bit precision, which matches perfectly with the native 32bit processing of the CEVA-TeakLite-4 DSP family.
"Music and multimedia content is increasingly consumed on small format, mobile devices such as smartphones and tablets, often via headphones or wireless speakers. ZIRENE® SOUND enables the audio quality of these devices to be optimized on a tightly constrained power budget and the excellent low-power operation of the CEVA-TeakLite-4 DSP consequently makes it an extremely good fit," says Jacob N. Andersen, Senior Vice President, AM3D A/S.
"We are very pleased to welcome AM3D into the CEVAnet partner program," says Moshe Sheier, Director of Strategic Marketing at CEVA. "ZIRENE® SOUND combined with our DSPs, offer a compelling solution that enables audio performance far superior to the physical sonic capabilities of most mobile and portable devices."
The CEVA-TeakLite-4 offers a scalable and extensible native 32-bit DSP family, allowing customers to choose the optimal core to address their specific audio/voice/sensing application needs, while keeping power consumption and die area to a minimum. For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4.
About AM3D, A/S.
AM3D provides world-class audio technology. The company delivers software solutions for audio enhancement and 3D audio for mobile phones and other portable devices, in-car and home entertainment systems and for mission-critical applications. It holds several patents on audio technologies. The head office is located in Aalborg, Denmark, and the company has subsidiaries in Tokyo, Japan, and in Seoul, South Korea. AM3D is owned by Nordjyske Holding A/S. The group has a history dating back to 1767 and has more than 2,000 employees working in the fields of newspapers, radio, television, call centers, new media research, development and technology. For more information, visit www.am3d.com.
About CEVA, Inc.
CEVA is the leading licensor of cellular, multimedia and connectivity technologies to semiconductor companies and OEMs serving the mobile, consumer, automotive and IoT markets. Our DSP IP portfolio includes comprehensive platforms for multimode 2G/3G/LTE/LTE-A baseband processing in terminals and infrastructure, computer vision and computational photography for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (Smart and Smart Ready), Wi-Fi (802.11 b/g/n/ac up to 4x4) and serial storage (SATA and SAS). One in every three phones sold worldwide is powered by CEVA, from many of the world's leading OEMs including Samsung, Huawei, Xiaomi, Lenovo, HTC, LG, Coolpad, ZTE, Micromax and Meizu. Visit us at www.ceva-dsp.com.