Innosilicon Receives "Best Partner of the Year 2015" Award from SMIC
November 3, 2015 – Innosilicon Technology Limited (“Innosilicon”), a world class innovative fabless design company focusing on high performance PHYs and mixed signal IP, today announced its receipt of the “Best Partner of the Year 2015 in China Mainland Region” award from SMIC in the 2015 SMIC Technology Symposium, which was held in Shanghai on Sept. 14th.
Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, gave the award to Innosilicon in recognition and appreciation of its support and trust, based on the factors of “business”, “technology”, “support for SMIC”, “reputation in the industry” and “IP usage volume”.
“In the eight years’ cooperation with SMIC, Innosilicon has developed into an excellent IP vendor which provides abundant IP solutions for customers, and most of the solutions are available through various SMIC processes.” said Hongying Wu, the Director of Design Enablement Center, in the award session of the symposium, “Among all the IP vendors in China, Innosilicon owns the largest customer base and has served quite a few SMIC customers. As a local company, Innosilicon’s main advantages are in providing world class fully customizable IP solutions with high performance-price ratio. Therefore, SMIC awards Innosilicon the Best IP Partner of 2015 in China.”
|
Related News
- eMemory Receives SMIC Best IP Partner Award for 4th Year in a Row
- SMIC Gives 2014 "Best IP Partner Award" of the Year
- Dolphin Integration receives TSMC's Open Innovation Platform 2015 Partner of the Year Award for Specialty IP
- SMIC Best IP Partner Award of 2015
- Imagination Receives TSMC 2015 Graphics Partner of the Year Award
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |