English
BQTF at Ericsson 1 of only 4 in World
Qualification Laboratory at Ericsson Technology Licensing 1 of only 4 in the world
As of September 4th, the BQTF (Bluetooth Qualificaiton Test Facility) at Ericsson Technology Licensing in Lund is recognized by the Bluetooth SIG for Protocol and Profile Conformance testing. This means that, in addition to prior recognition on Radio, Ericsson has now also received the "rest of the Bluetooth Conformance Qualification Testing" and can perform all Category A test cases.
This strengthens Ericsson's offer since they are one of four selected test facilities in the world which have been able to show this level of competence, capability and commitment to Bluetooth Qualification testing to the Bluetooth SIG.
|
||||||
Related News
- GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs
- Chinese Companies Hold Only 4% of Global IC Marketshare
- Gidel Launches Lossless Compression IP that Reduces Storage Needs by Over 50%, Utilizing Only 1% of the FPGA, with Low Power Consumption
- Mentor Graphics New Version of Platform Express Supports IP-XACT 1.4 Specification from The SPIRIT Consortium
- Tensilica Becomes First Processor IP Company to Support MPEG-4 AAC-LC and aacPlus Multi-Channel Decoders for 7.1 Surround Sound
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |