English
PACT announced beta availability of its XPP Vectorizing C-Compiler (XPP-VC) technology
 |
C way to reconfigurable ASICs
By David Larner, Embedded Systems
October 4, 2001 (10:51 a.m. EST)
URL: http://www.eetimes.com/story/OEG20011004S0034
PACT announced beta availability of its XPP Vectorizing C-Compiler (XPP-VC) technology. This is designed to allow developers to create "virtual reconfigurable ASICs" using existing C language source code as opposed to hardware programming in Verilog/VHDL or proprietary tools.
Related News
- HighTec C/C++ Compiler Suite Supports Andes' ISO 26262 Certified RISC-V IP for Automotive Safety and Security Applications
- SkyWater Announces Availability of SRAM Memory Compiler for 90 nm Strategic Rad Hard by Process Offering
- Intel announces open oneAPI initiative and development beta release with Data Parallel C++ language for programming CPUs, GPUs, FPGAs, and other accelerators
- IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality
- Latest Release of Synopsys' Design Compiler NXT is Ready for Broad Availability
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
|
E-mail This Article | 
|
|
Printer-Friendly Page |