NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Leti Strains to Improve FDSOI
Peter Clarke
12/17/2015 10:44 AM EST
LONDON—French research institute CEA-Leti has reported on two techniques to put local strain in the silicon channel of a fully-depleted silicon-on-insulator (FDSOI) manufacturing process.
STMicroelectronics and Globalfoundries are championing the FDSOI process as a means to achieve world-class energy efficiency in leading edge integrated circuits without the complexity and expense of FinFET manufacturing.
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