Rambus Explores Future Memory Systems
SUNNYVALE, Calif. -- December 17, 2015 --Rambus Inc. (NASDAQ: RMBS) today announced it will collaborate with Microsoft researchers in the exploration of future memory requirements for quantum computing. The expertise of Rambus in high-bandwidth, power-efficient memory architectures, combined with Microsoft researchers’ knowledge of advanced system and data center design will be applied to drive new technology platforms.
“Existing computer architectures are reaching limits due to the ever increasing demands of real-time data consumption, which is driving the need to explore new high-performance, energy-efficient computer systems,” said Gary Bronner, vice president of Rambus Labs. “By working with Microsoft on this project, we can leverage our vast expertise in memory systems to identify new architectural models.”
“We’ve been investing in projects that advance our understanding of quantum computing along with its applications and implementation,” said Douglas Carmean, Architect, Quantum Architectures and Computation Microsoft Research. “We are focusing on exploring theoretical and experimental approaches to creating quantum computers, designing software, hardware and other elements that support our research and direction. In this process, we are engaging with partners that have critical expertise, such as Rambus, to build new types of computing platforms.”
Rambus has a long history of researching and exploring emerging platforms, developing meaningful technologies with broad applicability. As part of this program, Rambus and Microsoft will pool resources to further examine potential architectures that can greatly enhance memory capabilities in various settings to improve overall system performance. Specific details of the project are confidential.
About Emerging Solutions Division
Inspired by the innovative thinking at the heart of Rambus Labs, the Emerging Solutions division at Rambus works to translate extraordinary theory into everyday practice, imagining exciting new ways to interpret and reimagine the world of data around us.
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
|
Related News
- Rambus Expands Cryogenic Memory Collaboration with Microsoft
- Arm Collaborates with Industry Leaders to Build AI Foundations of the Future
- Avery Design Systems and Rambus Extend Memory Model and PCIe VIP Collaboration
- Rambus to Develop Hybrid Memory System Architectures for Future Data Centers
- RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |