Mn_nH release AXI chip-to-chip interface IP and HEVC encoding expand up to 8K 30fps
December 28, 2015 -- Mn_nH release X2X AXI interconnection IP for chip to chip communication. X2X AXI chip to chip interface IP enable equivalent AXI functionality and performance but less I/O usage with raising the rate of utilisation of AXI signal. And X2X IP provide system to system, cpu to cpu and bus to bus freely accessible functions between chip and another chip.
These days, Moore’s law is slowing down and cost per transistor is rising despite of more micro fab process.
If IC’s mass production quantity will be not enough for optimal cost point at specific micro fab process, IC maker can’t stake their all at once design because large scaled IC require high design cost, large die size and low reusability at the latest micro process. So now chip’s expandability and reusability is becoming more and more important.
Mn_nH’s X2X AXI chip to chip interface IP make muliple chips operate like as one chip with AXI interfacing between chip and another chip. X2X’s system to system freely accessibility maximise chip’s expandability and reusability and apply to ASIC prototyping with multiple FPGA, AP system connected with heterogeneous multiple chips or parallel processing with same multiple chips.
X2X AXI chip to chip interface IP can be used for a variety of applications. Suppose Mn_nH’s HEVC encoder IP for 4K 30fps expand performance up 4K 60fps or 8K 30fps with X2X collaboration. This expandability help IC maker’s product planning and targeting have more flexible. Usually high performance application is unmarketable but leading market and middle-end performance application is high demand but a short life. Now, Mn_nH’s X2X and HEVC encoder collaboration suggest optimal HEVC encoder architecture to target both application at the present moment.
Mn_nH’s X2X AXI chip to chip interface IP and HEVC encoder IP are licensed 2 fabless customer and expected to start mass production at 2Q of 2016.
|
Related News
- OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions
- Open-Silicon Unveils Industry's Highest Performance Interlaken Chip-to-Chip Interface IP
- Mn_nH release deep-learing accelerated and 8-bit pixel anti-banding HEVC encoder.
- Kandou Delivers One Terabit Per Second of Chip-to-Chip Bandwidth at Less Than One Watt
- MoSys Announces Renesas Electronics Support of GigaChip Interface for Chip-to-Chip Communications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |