NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
ARM Exec's Straight Car Talk at CES
Q&A with ARM's Ian Drew
Junko Yoshida, EETimes
1/7/2016 06:46 PM EST
LAS VEGAS—Ian Drew, ARM’s executive vice president of marketing and business development, posed five questions that the automotive industry — or the tech industry in general — would rather not hear.
In a one-on-one interview with EE Times at the International Consumer Electronics Show Wednesday, we asked him about carmakers’ challenges in the increasingly connected world, and what roles ARM hopes to play in solving such problems
Drew didn’t mince words in answering the first question, but declined to offer specifics on the second.
He challenged the automotive industry about radical changes that will affect its business model, the security vulnerability that all cars are going to face and the unintended consequences that come with connectivity to the cloud.
Most important, he questioned consumers' faith in carmakers in a future in which every car will be tracked and carmakers will be collecting and owning their data.
In the end, Drew said the question comes down to this. “Do you trust Ford?”
The following are snippets of Drew’s no-nonsense car talk.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Arm Ltd Hot IP
Related News
- Former Intel exec to lead Arm's automotive and embedded business
- Ittiam's power-efficient VP9 and H.265 decoders optimized for ARM Mali and ARM Cortex-A processors showcased by ARM, Samsung System LSI and other partners at CES 2014
- Mindspeed to Showcase the Industry's First ARM Cortex A9-based Communications Processor with Integrated DPI at 2013 CES
- Exec details ST's ARM Cortex-A9 licensing choice for HDTVs
- Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation