DMP licenses GPU IP core "SMAPH-F" for Renesas Electronics' SoCs for Office Appliances
Tokyo, Japan -- January 12, 2016 -- Digital Media Professionals Inc. (DMP), a leading provider of 3D/2D graphics and computing intellectual property (IP) cores, today announced that it has licensed the DMP GPU core, SMAPH-F, to Renesas Electronics Corporation, for its SoCs (system-on-chips) for office appliances.
The DMP SMAPH-F is 2D Vector graphics IP core which is differentiated by its robust conformance to Khronos Group standards OpenVG and by its remarkably small silicon foot print which enables DMP licensees to maximize graphics performance delivered per square millimeter of silicon area and per mill watt of system power consumption.
“We are honored to license SMAPH-F Renesas’ SoCs for office appliances,” said Tatsuo Yamamoto, president & CEO at DMP, “DMP has been improving the performance and area size of SMAPH-F to ensure high performance capabilities which are required for consumer products such as office appliance and digital camera. We will continue to support customer development by providing our GPU IP core and professional services which are based on accumulated experience and know-how.”
About DMP
Digital Media Professionals Inc. (TOKYO: 3652) develops industry leading 2D and 3D graphics solutions for global consumer electronics, mobile, embedded and automotive markets. The company was founded in Tokyo, Japan in 2002 and is currently developing several graphics IP cores based on the Khronos™ Group open standards and DMP’s cutting edge 3D graphics IP “Maestro Technology”.
|
DMP Inc. Hot IP
Related News
- DMP GPU IP core Adopted for Nintendo's portable game console "New Nintendo 3DS"
- DMP 3D Graphics IP Core "SMAPH-S" is selected by Renesas Electronics
- Toshiba Electronics Europe Licenses SMSC's MediaLB Technology; Integration of MediaLB Interface Adds MOST(R) Connectivity to Advanced Automotive Display SoCs
- VeriSilicon's Vector Graphics GPU is selected by LG Electronics
- Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
Breaking News
- Silicon industry veteran Oreste Donzella joins Sondrel board as Non-Executive Director
- Powering the NVM and Embedded Chip Security Technologies
- BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC
- BBright Expands Ultra HD Capabilities with intoPIX JPEG XS Technology in its V2.2 Decoder Platform
- Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip
Most Popular
- MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
- Cadence and Rapidus Collaborate on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
- Quobly announces key milestone for fault-tolerant quantum computing
- Synopsys Announces Industry's First Ultra Ethernet and UALink IP Solutions to Connect Massive AI Accelerator Clusters
- Alphawave IP - Announcement regarding leadership transition
E-mail This Article | Printer-Friendly Page |