CAMPBELL, Calif. -- January 12, 2016 -- Arteris Inc., the inventor and leading supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that Renesas Electronics Europe has licensed Arteris® FlexNoC Physical™ IP for use in its High-End SoC business division.
Renesas Electronics Europe has been a long-time user and licensee of Arteris IP and has implemented Arteris FlexNoC in industrial and communications SoC designs. Their SoC development team chose the new Arteris FlexNoC Physical IP because of its ability to reduce the time and effort required for timing closure, which significantly reduces development schedule time.
“For our most complex SoCs, it has not been uncommon for us to iterate between our front-end and back-end design teams multiple times to achieve timing closure,” said Horst Rieger, Engineering Manager, Renesas Electronics Europe. “Time is money for us, and FlexNoC Physical IP helps us significantly reduce the amount of time and incremental information sharing between logical and physical design teams. FlexNoC Physical helps us remove the SoC interconnect from the critical path.”
“We are thrilled that Renesas Electronics Europe has chosen Arteris FlexNoC Physical IP to help reduce the time and pain of timing closure,” said K. Charles Janac, President and CEO of Arteris. “Renesas’ choice of FlexNoC Physical is a vote of confidence in technology specifically designed to reduce timing closure issues by using back-end information to quickly optimize front-end design.”
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at http://www.arteris.com.