Peter Clarke, EETimes
1/18/2016 04:10 PM EST
PARIS—NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.
Lees was speaking at an event to intended to emphasize that the enlarged NXP, after its merger with Freescale, is well place to offer processers, security and software for the Internet of Things in all of its various vertical applications, whether in the consumer, industrial, medical or automotives sectors.
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